Template:AMD Ryzen Mobile 7045 series

Common features of Ryzen 7045 notebook CPUs:

Socket: FL1.
All the CPUs support DDR5-5200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 1 MB per core.
All the CPUs support 28 PCIe 5.0 lanes.
Native USB 4 (40Gbps) Ports: 0
Native USB 3.2 Gen 2 (10Gbps) Ports: 4
Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)^[i].
Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).

Branding and model		Cores (threads)	Clock (GHz)		L3 cache (total)	Chiplets	Core config^[a]	TDP	Release date^[1]
Branding and model		Cores (threads)	Base	Boost	L3 cache (total)	Chiplets	Core config^[a]	TDP	Release date^[1]
Ryzen 9	7945HX3D	16 (32)	2.3	5.4	128 MB^[ii]	2 × CCD 1 × I/OD	2 × 8	55–75 W	July 27, 2023
	7945HX		2.5	5.4	64 MB				February 28, 2023
	7940HX		2.4	5.2					January 17, 2024
	7845HX	12 (24)	3.0	5.2			2 × 6	45–75 W	February 28, 2023
Ryzen 7	7840HX	12 (24)	2.9	5.1			2 × 6		January 17, 2024
Ryzen 7	7745HX	8 (16)	3.6	5.1	32 MB	1 × CCD 1 × I/OD	1 × 8		February 28, 2023
Ryzen 5	7645HX	6 (12)	4.0	5.0	32 MB	1 × CCD 1 × I/OD	1 × 6		February 28, 2023

^ Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
^ Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.

References