File:XCGPU-heatspreader.jpg
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Summary
| Description |
English: An illustration of the system on a chip (SoC) unit inside Microsoft's game console Xbox 360 S. This part is called XCGPU.
It's a multi chip module, consisting of two chips, but they are all hidden under the heatspreader. The chips of this specimen was manufactured by Global Foundries in Singapore but the complete device was packaged by IBM at their plant in Bromont, Canada. It was manufactured sometime in 2010. Inspiration for the image comes from pictures at GiggleHD.com |
| Date | |
| Source | Own work |
| Author | Henriok |
Licensing
I, the copyright holder of this work, hereby publish it under the following license:
 
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This file is made available under the Creative Commons CC0 1.0 Universal Public Domain Dedication. |
| The person who associated a work with this deed has dedicated the work to the public domain by waiving all of their rights to the work worldwide under copyright law, including all related and neighboring rights, to the extent allowed by law. You can copy, modify, distribute and perform the work, even for commercial purposes, all without asking permission.
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File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 19:01, 11 January 2013 | | 1,488 × 1,488 (876 KB) | Henriok | User created page with UploadWizard |
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