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Summary
| Description |
English: Schematic showing different scenarios in electroplating. (a) faster deposition rate at the top, (b) uniform deposition rate and (c) faster deposition rate at the bottom (superfill). |
| Date | |
| Source | Jhothiraman, J.K. and Balachandran, R. (2019) Electroplating: Applications in the Semiconductor Industry. Advances in Chemical Engineering and Science, 9, 239-261. https://doi.org/10.4236/aces.2019.92018 |
| Author |
Jhothiraman, J.K. and Balachandran, R. Copyright © 2019 by author(s) and Scientific Research Publishing Inc. This work is licensed under the Creative Commons Attribution International License (CC BY 4.0). https://creativecommons.org/licenses/by/4.0/ |
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 12:52, 15 February 2023 | | 840 × 861 (310 KB) | Walter Tau | Uploaded a work by Jhothiraman, J.K. and Balachandran, R. Copyright © 2019 by author(s) and Scientific Research Publishing Inc. This work is licensed under the Creative Commons Attribution International License (CC BY 4.0). http://creativecommons.org/licenses/by/4.0/ from Jhothiraman, J.K. and Balachandran, R. (2019) Electroplating: Applications in the Semiconductor Industry. Advances in Chemical Engineering and Science, 9, 239-261. https://doi.org/10.4236/aces.2019.92018 with UploadWizard |
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