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Summary

Description
English: Microscopic cross sectional SEM images of glass frit bonded silicon wafers from Bosch.
Date
Source

M. Petzold and C. Dresbach and M. Ebert and J. Bagdahn and M. Wiemer and K. Glien and J. Graf and R. Müller-Fiedler and H. Höfer, Fracture mechanical life-time investigation of glass frit-bonded sensors (2006)

Author

Fraunhofer ENAS, D. Neumann

Uploaded by Enaswiki at en.wikipedia

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  • 2011-03-30 11:33 (UTC) | Enaswiki | 268400 (bytes) | 1511×1182 | {{Information |Description = Microscopic cross sectional SEM images of glass frit bonded silicon wafers from Bosch. |Source = M. Petzold and C. Dresbach and M. Ebert and J. Bagdahn and M. Wiemer and K. Glien and J. Graf and R. Müller-Fiedler

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current12:28, 27 December 2011Thumbnail for version as of 12:28, 27 December 20111,511 × 1,182 (262 KB)SreeBot(Original text) : {{Information |Description = Microscopic cross sectional SEM images of glass frit bonded silicon wafers from Bosch. |Source = M. Petzold and C. Dresbach and M. Ebert and J. Bagdahn and M. Wiemer and K. Glien and J. Graf and

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