Flexible electronics: Difference between revisions
m adding link to wikipedia and ledfilm.ch |
m rmv spalink |
||
| Line 3: | Line 3: | ||
[[Image:Olympus Stylus.jpg|thumb|250px|An Olympus Stylus camera without the case, showing the flex circuit assembly.]] |
[[Image:Olympus Stylus.jpg|thumb|250px|An Olympus Stylus camera without the case, showing the flex circuit assembly.]] |
||
'''Flexible electronics''', also known as ''flex circuits'', is a [[technology]] for assembling [[electronic circuit]]s by mounting electronic devices on [[flexible]] [[plastic]] [[Substrate (materials science)|substrate]]s, such as [[polyimide]], [[PEEK]] or [[LED_Headliner|transparent conductive Polyester]]<ref>D. Shavit: The developments of LEDs and SMD Electronics on transparent conductive Polyester film, Vacuum International, 1/2007, S. 35 ff |
'''Flexible electronics''', also known as ''flex circuits'', is a [[technology]] for assembling [[electronic circuit]]s by mounting electronic devices on [[flexible]] [[plastic]] [[Substrate (materials science)|substrate]]s, such as [[polyimide]], [[PEEK]] or [[LED_Headliner|transparent conductive Polyester]]<ref>D. Shavit: The developments of LEDs and SMD Electronics on transparent conductive Polyester film, Vacuum International, 1/2007, S. 35 ff</ref> film. Additionally, flex circuits can be [[screen printing|screen printed]] silver circuits on [[polyester]]. Flexible electronic assemblies may be manufactured using identical components used for rigid [[printed circuit board]]s, allowing the board to conform to a desired shape, or to flex during its use. These flexible printed circuits (FPC) are made with a photolithographic technology. An alternative way of making flexible foil circuits (FFCs) is laminating very thin (0.07 mm) copper strips in between two layers of PET. These PET layers, typically 0.05 mm thick, are coated with an adhesive which is thermosetting, and will be activated during the lamination process. FPCs and FFCs have several advantages in many applications: |
||
* Tightly assembled electronic packages, where electrical connections are required in 3 axes, such as [[cameras]] (static application). |
* Tightly assembled electronic packages, where electrical connections are required in 3 axes, such as [[cameras]] (static application). |
||
* Electrical connections where the assembly is required to flex during its normal use, such as folding [[cell phones]] (dynamic application). |
* Electrical connections where the assembly is required to flex during its normal use, such as folding [[cell phones]] (dynamic application). |
||
| Line 26: | Line 26: | ||
==See also== |
==See also== |
||
{{colbegin|3}} |
|||
* [[Amorphous silicon]] |
* [[Amorphous silicon]] |
||
* [[Copper indium gallium selenide]] (CIGS) |
* [[Copper indium gallium selenide]] (CIGS) |
||
| Line 39: | Line 40: | ||
* [[Stretchable electronics]] |
* [[Stretchable electronics]] |
||
* [[Thin film]] |
* [[Thin film]] |
||
{{colend}} |
|||
==References== |
==References== |
||
Revision as of 01:00, 24 December 2010
 | It has been suggested that this article be merged with Flexible circuit. (Discuss) Proposed since December 2010. |
 |
Flexible electronics, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates, such as polyimide, PEEK or transparent conductive Polyester[1] film. Additionally, flex circuits can be screen printed silver circuits on polyester. Flexible electronic assemblies may be manufactured using identical components used for rigid printed circuit boards, allowing the board to conform to a desired shape, or to flex during its use. These flexible printed circuits (FPC) are made with a photolithographic technology. An alternative way of making flexible foil circuits (FFCs) is laminating very thin (0.07 mm) copper strips in between two layers of PET. These PET layers, typically 0.05 mm thick, are coated with an adhesive which is thermosetting, and will be activated during the lamination process. FPCs and FFCs have several advantages in many applications:
- Tightly assembled electronic packages, where electrical connections are required in 3 axes, such as cameras (static application).
- Electrical connections where the assembly is required to flex during its normal use, such as folding cell phones (dynamic application).
- Electrical connections between sub-assemblies to replace wire harnesses, which are heavier and bulkier, such as in cars, rockets and satellites.
- Electrical connections where board thickness or space constraints are driving factors.
Applications
Flex circuits are often used as connectors in various applications where flexibility, space savings, or production constraints limit the serviceability of rigid circuit boards or hand wiring. In addition to cameras, a common application of flex circuits is in computer keyboard manufacturing; most keyboards made today use flex circuits for the switch matrix.
In LCD fabrication, glass is used as a substrate. If thin flexible plastic or metal foil is used as the substrate instead, the entire system can be flexible, as the film deposited on top of the substrate is usually very thin, on the order of a few micrometres.
OLEDs are normally used instead of a back-light for flexible displays, making a flexible organic light-emitting diode display.
Photovoltaic cells
Flexible solar cells have been developed for powering satellites. These cells are lightweight, can be rolled up for launch, and are easily deployable, making them a good match for the application.
On the other hand, Copper indium gallium diselenide (CIGS) solar cells are lightweight, flexible, and durable, which make them ideal for portable power (including solar jackets). CIGS is 1.5 to 2x greater in performance than comparable thin-film flexible solar materials.
![[icon]](/wiki/File:Wiki_letter_w_cropped.svg){kind=small} | This section needs expansion. You can help by adding to it. (June 2010) |
See also
References
- ^ D. Shavit: The developments of LEDs and SMD Electronics on transparent conductive Polyester film, Vacuum International, 1/2007, S. 35 ff